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Tech Head - The Technology Section
The Work Bench and Soldering Station
Just done my first re-flow
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<blockquote data-quote="Vipersan" data-source="post: 768321" data-attributes="member: 325666"><p>Hi friends ..</p><p>..a couple of weeks have now passed since I 'reworked the graphics chip on this laptop ..</p><p>As expected the cure ..although effective ..thus proving where the ploblem lay...was but temporary ...</p><p>The lappy failed to power up on the 4th day following the initial re-flow ..</p><p>So ..having nothing to lose I got a bit more creative ...</p><p>First I pre-heated the chip to 100 degress again ..thus softening the plasic cement the manufaturer had spread around the edges of the chip ..to secure it to the pcb ...allowing it to be sraped off</p><p>I figured some of this plastic glue ..may have leached under the edges of the chip making the chip less likely to bed down when re-worked.</p><p>This allowed me to inject a small quantity of liquid flux with a syringe around the edges where the plastic glue was previously ..</p><p>Hoping that capillary action would draw the flux under the bga chip when preheated ..</p><p>I then created a tin plate metal funnel which fitted around the perimeter of the chip ..thus directing heat exclusively onto the chip ..and doing away with the need to wrap the motherboard in aluminium foil..</p><p>The process was then repeated ..pre-heating at 100 degrees for 3 minutes ....then blasting the chip directly using the funnel for a further 10 minutes ..and allowing to cool naturally ..</p><p>This time tho' the blast temperature was set to 300 degrees ..</p><p>Hotter by far than recommended ..but hey ...what had I to lose ?</p><p></p><p>After cooling the motherboard was tested again ..</p><p>It powered up to a nice bright Vista screen ...and the lappy fully reassembled ..</p><p></p><p>It was then left to run a looped 720p video file for many days ..to really heat up the graphics chip ..with short cooling periods every 5 hours ..to give the reflow a chance to dry joint again ..if it had a mind to.</p><p>I ran the lappy right through the Indian summer so it get pretty darned hot...</p><p>We are a now 10 days down the line since the second re-flow ...and the lappy _still_ functions normally..</p><p>Fingers crossed as it may yet fail again ..</p><p>The ideal solution would be to re-ball the chip ..and maybe one day I will ..</p><p>...but need to get some practice in first..but</p><p>..I'm no longer as scared of these modern chip formats as I once was </p><p>rgds</p><p>VS</p></blockquote><p></p>
[QUOTE="Vipersan, post: 768321, member: 325666"] Hi friends .. ..a couple of weeks have now passed since I 'reworked the graphics chip on this laptop .. As expected the cure ..although effective ..thus proving where the ploblem lay...was but temporary ... The lappy failed to power up on the 4th day following the initial re-flow .. So ..having nothing to lose I got a bit more creative ... First I pre-heated the chip to 100 degress again ..thus softening the plasic cement the manufaturer had spread around the edges of the chip ..to secure it to the pcb ...allowing it to be sraped off I figured some of this plastic glue ..may have leached under the edges of the chip making the chip less likely to bed down when re-worked. This allowed me to inject a small quantity of liquid flux with a syringe around the edges where the plastic glue was previously .. Hoping that capillary action would draw the flux under the bga chip when preheated .. I then created a tin plate metal funnel which fitted around the perimeter of the chip ..thus directing heat exclusively onto the chip ..and doing away with the need to wrap the motherboard in aluminium foil.. The process was then repeated ..pre-heating at 100 degrees for 3 minutes ....then blasting the chip directly using the funnel for a further 10 minutes ..and allowing to cool naturally .. This time tho' the blast temperature was set to 300 degrees .. Hotter by far than recommended ..but hey ...what had I to lose ? After cooling the motherboard was tested again .. It powered up to a nice bright Vista screen ...and the lappy fully reassembled .. It was then left to run a looped 720p video file for many days ..to really heat up the graphics chip ..with short cooling periods every 5 hours ..to give the reflow a chance to dry joint again ..if it had a mind to. I ran the lappy right through the Indian summer so it get pretty darned hot... We are a now 10 days down the line since the second re-flow ...and the lappy _still_ functions normally.. Fingers crossed as it may yet fail again .. The ideal solution would be to re-ball the chip ..and maybe one day I will .. ...but need to get some practice in first..but ..I'm no longer as scared of these modern chip formats as I once was rgds VS [/QUOTE]
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Tech Head - The Technology Section
The Work Bench and Soldering Station
Just done my first re-flow
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