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<blockquote data-quote="Vipersan" data-source="post: 794632" data-attributes="member: 325666">Not really Pete ...Its for reworking ...or resoldering dry joints on BGA chips .....or indeed reballing ..that is to say applying solder balls to these chips and detaching or attaching such chips ..BGA (ball grid array)chips unlike conventional ICs have hundreds&nbsp; of solder ball connections _under_ the chip ...so no way to get a soldering Iron to them ..either to fix drys ,,or fit a new chip .This ACHI unit is capable of controlled heating in ramped stages to melt the solder balls and attach /reattach chips to the pcb by pumping heat through the chip body ..and melt the solder connections underneath..Using controlled heat in this way makes it possible without frying the chip in the process ..5 &gt; 10 degrees too much ..for too long a time may destroy the chip even before is connected.This is the future and these chips are in everything from TVs ...PCs Laptops Phones ..to sat boxes..and hi-fi s etc ..Here is a picture of a typical BGA chip underside .....and this one hasn't many connectionsrgdsVS</blockquote>

[QUOTE="Vipersan, post: 794632, member: 325666"] Not really Pete ... Its for reworking ...or resoldering dry joints on BGA chips ... ..or indeed reballing ..that is to say applying solder balls to these chips and detaching or attaching such chips .. BGA (ball grid array)chips unlike conventional ICs have hundreds of solder ball connections _under_ the chip ...so no way to get a soldering Iron to them ..either to fix drys ,,or fit a new chip . This ACHI unit is capable of controlled heating in ramped stages to melt the solder balls and attach /reattach chips to the pcb by pumping heat through the chip body ..and melt the solder connections underneath.. Using controlled heat in this way makes it possible without frying the chip in the process .. 5 > 10 degrees too much ..for too long a time may destroy the chip even before is connected. This is the future and these chips are in everything from TVs ...PCs Laptops Phones ..to sat boxes..and hi-fi s etc .. Here is a picture of a typical BGA chip underside ... ..and this one hasn't many connections rgds VS [/QUOTE]

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